Sputtering targets are the source materials for the preparation of sputtered thin films. In particular, high-purity sputtering targets are used in the physical vapor deposition (PVD) process for the manufacture of electronic components, and are key materials for the preparation of surface electronic films such as wafers, panels, and solar cells. In a vacuum state, accelerated ions are used to bombard the solid surface. The ions and the atoms on the solid surface exchange momentum, so that the atoms on the solid surface leave the solid and deposit on the substrate surface to form the required thin film. This process is called sputtering. The bombarded solid is the source material for depositing thin films by sputtering, that is, the sputtering target.
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In recent years, the advancement of semiconductor technology, the increasing use of electronic devices, and the continuous research and development of materials science are driving the growth of the sputtering target market. As an emerging player in this market, Alfa Chemistry has launched their comprehensive product line of sputtering targets.
From the perspective of chemical composition, sputtering targets are mainly divided into metal targets, alloy targets and ceramic compound targets:
From the shape classification, sputtering targets can be divided into planar targets and rotating targets:
The choice of targets not only dictates the composition of the deposited film, but also its microstructure, adhesion, electrical and optical characteristics. Purity, density, grain size, mechanical properties, thermal and electrical conductivity, deposition rate are a few of the influencing factors in choosing a sputtering target.
It is very important to make sputtering targets correctly for device performance and getting quality thin films. If targets are not made properly then contamination, uneven coatings and material waste can occur. In this blog post we will cover materials, manufacturing steps, applications as well as quality control methods to help you get the best results in sputtering target production.
A procedure known as sputtering uses energetic ions (mostly from a plasma) to hit a solid target. This impact knocks atoms off the target surface. These atoms then settle as a thin film on another surface named as substrate. Many industries use this method to apply precise coatings in optics, electronics and nanotechnology.
Choice of right material for sputtering targets affects both thin film performance & quality. Different materials have different properties, so each one is appropriate for particular uses in electronics, energy or optics.
Manufacturers mostly choose pure metals as sputtering targets such as aluminum, copper, gold, silver as well as titanium. These metals have good sputtering rates and give high purity. As stable film quality depends on these two.
Carbides, nitrides and oxides are examples of compounds used for their chemical stability and hardness. These materials are important for coatings which need to be both functional and durable.
Alloys like nickel‐chromium, stainless steel and titanium are chosen when corrosion resistance or extra strength is required. These alloys allow manufacturers to adjust properties for particular needs.
Ceramics such as silicon carbide (SiC) and alumina (Al₂O₃) are valued for their heat resistance and hardness. These materials have a main role in protective and optical coatings where long lasting durability is required.
High entropy alloys mix five or more elements in nearly equal amounts. These alloys give strong corrosion resistance and high hardness. So they work well in harsh environments.
Sputtering target manufacturing starts with raw material selection. We choose metals and compounds with 99.99% purity to assure high film quality and limit defects. Strict physical and chemical standards must be met by the chosen material.
At RICHCONN we source only ultra high purity compounds and metals. This guarantees that our customers get products which meet the industry’s highest standards.
After material selection the next step is melting and mixing to form a target. This is done by arc melting or vacuum induction melting at a temperature of above °C. Proper alloying at this stage increases corrosion resistance and strength.
Once melting and alloying is done it’s time to shape the material into sputtering targets. You can use different methods and every method has its own advantages.
In powder metallurgy metal powders are pressed into the intended shape and then heated below their melting point. This gives us precise control over density and composition. It is important for those sputtering targets which need high performance.
Casting makes targets by pouring molten metal into molds. It is appropriate for large targets. But it can sometimes cause uneven composition or porosity which can affect performance.
To solve this problem our team machines cast blanks with precision CNC equipment. This step gives higher tolerances and assures more stable quality for demanding applications.
Hot pressing uses both heat & pressure to turn powders into solid targets. This reduces defects and increases mechanical strength. So the targets become more reliable for harsh applications.
CIP forms uniform and dense targets by applying equal pressure from all sides to powder‐filled molds at normal temperature. This reduces weak spots and produces targets which are good for stable thin film deposition.
HIP removes internal voids by using high pressure & temperature in a gaseous environment. This produces targets with high strength and density. These are particularly important for applications where reliability is key.
The target is heat treated after forming. Technician’s heat and cool this material at 400 to °C in a controlled manner. This relieves internal stresses and refines the grain structure. As a result target gets stronger and performs better during sputtering.
Machining and finishing comes after heat treatment. At this point the target is machined to precise dimensions and surface is finished to get smoothness. Procedures like grinding, polishing & lapping are used to remove any defects and to keep uniform thickness. Moreover target’s surface roughness is kept very low (about <0.1 micrometers) to support high quality film creation.
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Also See: What is Precision Grinding
Quality control and testing is the last step. Every target is inspected for uniformity and defects. These tests are chemical composition analysis, density measurement and ultrasonic inspection. They identify problems like cracks or porosity. Only those targets which meet industry standards move forward for thin film deposition.
Manufacturers make different types of sputtering targets to meet different equipment & application needs. Every type has its own benefits for thin film development.
Planar targets are the most used targets. These have flat, circular or rectangular shapes. They are affordable & simple. Moreover they are easy to manufacture so they are good for prototypes.
Bonded targets have a thin sputtering layer bonded to a backing plate mostly aluminum or copper. This not only reduces material cost but simplifies handling too. It’s particularly useful for expensive or fragile materials.
Rotary targets have a cylindrical shape & rotate during sputtering. This rotation cools the target, increases its life & uses the material more proficiently. Therefore large scale production mostly uses this design.
Custom targets cater to particular manufacturing needs. They can have unusual materials, shapes or sizes which gives more adaptability in advanced applications.
RICHCONN produces custom targets for clients with particular needs. These can be complicated alloys or irregular shapes made with the help of EDM, CNC machining as well as additive manufacturing. For example RICHCONN recently supplied a semiconductor company with a batch of Mo‐Ti alloy targets. These targets were able to bear ±0.05 mm tolerances for the sake of modern device fabrication.
Manufacturers use sputtering targets to make memory chips, microchips & flat panel displays. They choose high purity materials such as tantalum to get uniform conductive layers. These layers are key to device speed and reliability.
Solar panel makers use sputtering targets to deposit materials such as cadmium telluride and silicon. The resulting thin films not only increase durability of panel but energy conversion proficiency too.
Sputtering targets help apply protective and anti reflectives coatings to items like eyeglasses, sunglasses, mirrors as well as optical filters. These coatings improve durability and clarity. So they are well known in laser technology and consumer optics.
Sputtering targets make low emissivity (Low E) coatings for architectural glass. These coatings help buildings save energy by controlling light and heat transmission. They also improve the look of glass and are affordable.
Thin films from sputtering targets are important for magnetic storage media and hard drives. These films support long term storage & data recording.
A number of issues occur during manufacturing sputtering targets and they affect both cost & quality. Some main problems are given as under.
Getting high purity i.e., mostly above 99.99% is difficult. Tiny impurities can cause defects in thin films & lower device functionality.
It’s not easy to keep flatness and dimensions accurate– particularly for complicated or large targets. Minor mistakes can cause uneven coatings or poor tool fit.
High quality raw materials are very pricey and sometimes it is hard to obtain them. So it can increase cost of manufacturing and lead time.
Uniform density and composition is hard to guarantee. Any changes can not only cause uneven sputtering but poor film quality too.
Sputtering targets are needed for high quality thin films in optics, energy as well as electronics market. Their processing demands control of uniformity, purity & exact dimensions for applications such as solar cells or semiconductors.
If you need precisely engineered sputtering targets or any other CNC machining work then Richconn is your best option. You can contact us anytime.
High purity material limits impurities in the film. This results in better coating & prevents film failure.
When you apply pressure and heat together in vacuum hot pressing, it densifies the target. This makes the target more durable and lowers its porosity.
Backing plates support target, secure it to the tool & also increase its electrical & heat conductivity.
Main factors are density, grain size, purity, porosity and uniformity which affects the target.
Sputtering targets allows thin film deposition. These films are needed for integrated circuits & electronic devices.
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